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newspaper page transmission via satellite - translation to russian
1973 LIVE ALBUM BY ELVIS PRESLEY
Aloha From Hawaii (album); Aloha From Hawaii: Via Satellite; Aloha from Hawaii: Via Satellite; Aloha from Hawaii Via Satellite (album)
newspaper page transmission via satellite
передача (изображений) газетных полос через спутник связи
blind via
![Different types of vias:<br/> ('''1''') [[Through hole]].<br/> ('''2''') Blind via.<br/> ('''3''') Buried via.<br/>The gray and green layers are nonconducting, while the thin orange layers and red vias are conductive.](https://commons.wikimedia.org/wiki/Special:FilePath/Via Types.svg?width=200 "Different types of vias:<br/> ('''1''') [[Through hole]].<br/> ('''2''') Blind via.<br/> ('''3''') Buried via.<br/>The gray and green layers are nonconducting, while the thin orange layers and red vias are conductive.")
CONNECTION BETWEEN LAYERS IN AN ELECTRONIC CIRCUIT
Blind via; Thermal via; Castellated Hole; Via hole; Vertical interconnect access; Vertical Interconnect Access; VIA (electronics); Buried via; Deep vertical interconnect access; DVIA (electronics); Castellated hole; Plugged via; Stacked via; Staggered via; Filled via; Capped via; Tented via; Via-hole; Non-through via; Non-thru via; Non Through Via; Through Via; Through via; Non-through via hole; Non-thru via hole; Through via hole; Via-in-pad; Via plugging; Via tenting; Via filling; Tented & covered via; Tented and covered via; Covered via; Plugged buried via; Plugged & covered via; Plugged and covered via; Filled & covered via; Filled and covered via; Filled & capped via; Filled and capped via; Microvia filling; Filled microvia; Micro-via filling; Filled micro-via; Via capping; Via cap; Via fill; Via plug; Copper capped via; Blind micro via; Blind microvia; Through-glass via; Tenting via; LPI tenting; Liquid photoimageable solder mask tenting; Tenting (via); PCB via tenting; Tent a via; Tenting a via; PCB Via; Covered annular ring; Type I via; IPC type I via; IPC 4761 type I via; IPC 4761 type I; IPC 4761 Type I; Type II via; IPC type II via; IPC 4761 type II via; IPC 4761 type II; IPC 4761 Type II; Type III via; IPC type III via; IPC 4761 type III via; IPC 4761 type III; IPC 4761 Type III; Type III-a via; IPC type III-a via; IPC 4761 type III-a via; IPC 4761 type III-a; IPC 4761 Type III-a; Type III-b via; IPC type III-b via; IPC 4761 type III-b via; IPC 4761 type III-b; IPC 4761 Type III-b; Type IV via; IPC type IV via; IPC 4761 type IV via; IPC 4761 type IV; IPC 4761 Type IV; Type IV-a via; IPC type IV-a via; IPC 4761 type IV-a via; IPC 4761 type IV-a; IPC 4761 Type IV-a; Type IV-b via; IPC type IV-b via; IPC 4761 type IV-b via; IPC 4761 type IV-b; IPC 4761 Type IV-b; Type V via; IPC type V via; IPC 4761 type V via; IPC 4761 type V; IPC 4761 Type V; Type VI via; IPC type VI via; IPC 4761 type VI via; IPC 4761 type VI; IPC 4761 Type VI; Type VI-a via; IPC type VI-a via; IPC 4761 type VI-a via; IPC 4761 type VI-a; IPC 4761 Type VI-a; Type VI-b via; IPC type VI-b via; IPC 4761 type VI-b via; IPC 4761 type VI-b; IPC 4761 Type VI-b; Type VII via; IPC type VII via; IPC 4761 type VII via; IPC 4761 type VII; IPC 4761 Type VII; IPC 4761; Padstack; Pad stack; Via stack; Viastack; Thermovia
общая лексика
глухое переходное отверстие
в САПР электроники - несквозное переходное отверстие, которое достигает только одного внешнего слоя печатной платы
Смотрите также
through via
CONNECTION BETWEEN LAYERS IN AN ELECTRONIC CIRCUIT
Blind via; Thermal via; Castellated Hole; Via hole; Vertical interconnect access; Vertical Interconnect Access; VIA (electronics); Buried via; Deep vertical interconnect access; DVIA (electronics); Castellated hole; Plugged via; Stacked via; Staggered via; Filled via; Capped via; Tented via; Via-hole; Non-through via; Non-thru via; Non Through Via; Through Via; Through via; Non-through via hole; Non-thru via hole; Through via hole; Via-in-pad; Via plugging; Via tenting; Via filling; Tented & covered via; Tented and covered via; Covered via; Plugged buried via; Plugged & covered via; Plugged and covered via; Filled & covered via; Filled and covered via; Filled & capped via; Filled and capped via; Microvia filling; Filled microvia; Micro-via filling; Filled micro-via; Via capping; Via cap; Via fill; Via plug; Copper capped via; Blind micro via; Blind microvia; Through-glass via; Tenting via; LPI tenting; Liquid photoimageable solder mask tenting; Tenting (via); PCB via tenting; Tent a via; Tenting a via; PCB Via; Covered annular ring; Type I via; IPC type I via; IPC 4761 type I via; IPC 4761 type I; IPC 4761 Type I; Type II via; IPC type II via; IPC 4761 type II via; IPC 4761 type II; IPC 4761 Type II; Type III via; IPC type III via; IPC 4761 type III via; IPC 4761 type III; IPC 4761 Type III; Type III-a via; IPC type III-a via; IPC 4761 type III-a via; IPC 4761 type III-a; IPC 4761 Type III-a; Type III-b via; IPC type III-b via; IPC 4761 type III-b via; IPC 4761 type III-b; IPC 4761 Type III-b; Type IV via; IPC type IV via; IPC 4761 type IV via; IPC 4761 type IV; IPC 4761 Type IV; Type IV-a via; IPC type IV-a via; IPC 4761 type IV-a via; IPC 4761 type IV-a; IPC 4761 Type IV-a; Type IV-b via; IPC type IV-b via; IPC 4761 type IV-b via; IPC 4761 type IV-b; IPC 4761 Type IV-b; Type V via; IPC type V via; IPC 4761 type V via; IPC 4761 type V; IPC 4761 Type V; Type VI via; IPC type VI via; IPC 4761 type VI via; IPC 4761 type VI; IPC 4761 Type VI; Type VI-a via; IPC type VI-a via; IPC 4761 type VI-a via; IPC 4761 type VI-a; IPC 4761 Type VI-a; Type VI-b via; IPC type VI-b via; IPC 4761 type VI-b via; IPC 4761 type VI-b; IPC 4761 Type VI-b; Type VII via; IPC type VII via; IPC 4761 type VII via; IPC 4761 type VII; IPC 4761 Type VII; IPC 4761; Padstack; Pad stack; Via stack; Viastack; Thermovia
Definition
Аппиева дорога
(via Appia)
первая римская мощёная дорога (протяжённость ок. 350 км). Была проложена со стратегической целью при цензоре 312 до н. э. Аппии Клавдии (откуда её название) между Римом и Капуей; позже (в 244 до н. э.) доведена до Брундизия. А. д. была выложена из квадратных камней, по ней свободно могли проехать, не сталкиваясь, два воза. Вдоль А. д. (около Рима) сохранились памятники древнего некрополя (кладбища) языческого и раннехристианского времени.
Аппиева дорога.
Wikipedia
Aloha from Hawaii via Satellite (album)
Aloha from Hawaii via Satellite is a live album by American singer and musician Elvis Presley, released by RCA Records in February 1973. The album consists of recordings from Presley's January 1973 concert of the same name. It peaked at #1 on the Billboard chart in the spring of the same year. Despite the satellite innovation, the concert did not air in the United States until April 4. Aloha from Hawaii (which was a worldwide ratings smash) went to #1 on the Billboard album chart. The album dominated the charts, reaching #1 in both the pop and country charts in the US.
The album was certified Gold on February 13, 1973, platinum and 2× Platinum on May 20, 1988, 3× Platinum on July 15, 1999, and 5× Platinum on August 1, 2002, by the RIAA. On April 15, 2016, the BPI certified the album Silver for sales of 60,000 units.
